- HDI板干膜前处理 →提高线路良率
- DF pretreatment for HDI →Increase quality rate
- 内层板干膜/湿膜前处理 →低蚀铜量
- Inner DF/LP pretreatment →Minimum amount of etching
- 外层板干膜前处理 →优于火山灰磨板（不塞孔）不渗镀
- Outer DF pretreatment →exceed pumice scrub pretreatment (no block hole); no diffusion plating
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